3d Stacked Chips
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Language: en
Pages: 354
Pages: 354
Type: BOOK - Published: 2016-05-11 - Publisher: Springer
This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices th
Language: en
Pages: 655
Pages: 655
Type: BOOK - Published: 2019-01-25 - Publisher: John Wiley & Sons
This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and mate
Language: en
Pages: 409
Pages: 409
Type: BOOK - Published: 2017-12-19 - Publisher: CRC Press
Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3
Language: en
Pages: 214
Pages: 214
Type: BOOK - Published: 2010-06-03 - Publisher: Springer Science & Business Media
Wafer-scale integration has long been the dream of system designers. Instead of chopping a wafer into a few hundred or a few thousand chips, one would just conn
Language: en
Pages: 302
Pages: 302
Type: BOOK - Published: 2018-09-03 - Publisher: CRC Press
Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration req
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