Chiplet Design And Heterogeneous Integration Packaging

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Chiplet Design and Heterogeneous Integration Packaging
Language: en
Pages: 542
Authors: John H. Lau
Categories: Technology & Engineering
Type: BOOK - Published: 2023-03-27 - Publisher: Springer Nature

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The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and e
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The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and
Heterogeneous Integrations
Language: en
Pages: 381
Authors: John H. Lau
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Type: BOOK - Published: 2019-04-03 - Publisher: Springer

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Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different funct
Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces
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Discover an up-to-date exploration of Embedded and Fan-Out Waver and Panel Level technologies In Embedded and Fan-Out Wafer and Panel Level Packaging Technologi