Fan Out Wafer Level Packaging
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Discover an up-to-date exploration of Embedded and Fan-Out Waver and Panel Level technologies In Embedded and Fan-Out Wafer and Panel Level Packaging Technologi
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Type: BOOK - Published: 2018-04-05 - Publisher: Springer
This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the cur
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Type: BOOK - Published: 2015-07-06 - Publisher: McGraw Hill Professional
A comprehensive guide to 3D IC integration and packaging technology3D IC Integration and Packaging fully explains the latest microelectronics techniques for inc
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