Handbook Of 3d Integration Volume 4

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Handbook of 3D Integration, Volume 4
Language: en
Pages: 492
Authors: Paul D. Franzon
Categories: Technology & Engineering
Type: BOOK - Published: 2019-01-25 - Publisher: John Wiley & Sons

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This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and mate
Handbook of 3D Integration, Volume 1
Language: en
Pages: 798
Authors: Philip Garrou
Categories: Technology & Engineering
Type: BOOK - Published: 2011-09-22 - Publisher: John Wiley & Sons

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The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the r
Handbook of 3D Integration, Volume 4
Language: en
Pages: 488
Authors: Paul D. Franzon
Categories: Technology & Engineering
Type: BOOK - Published: 2019-05-06 - Publisher: John Wiley & Sons

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This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and mate
Handbook of 3D Integration, Volume 3
Language: en
Pages: 484
Authors: Philip Garrou
Categories: Technology & Engineering
Type: BOOK - Published: 2014-07-21 - Publisher: John Wiley & Sons

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Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate d
3D IC Integration and Packaging
Language: en
Pages: 481
Authors: John H. Lau
Categories: Technology & Engineering
Type: BOOK - Published: 2015-07-06 - Publisher: McGraw Hill Professional

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A comprehensive guide to 3D IC integration and packaging technology3D IC Integration and Packaging fully explains the latest microelectronics techniques for inc