Thermal Design Of Electronic Equipment
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Language: en
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Type: BOOK - Published: 2017-12-19 - Publisher: CRC Press
In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating,
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In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating,
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Type: BOOK - Published: 1998-02-28 - Publisher: Springer Science & Business Media
With today's high density, high performance electronic systems, packaging and more specifically thermal engineering has become the critical factor that limits o
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Pages: 526
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Type: BOOK - Published: 2009-12-17 - Publisher: CRC Press
The continuing trend toward miniaturization and high power density electronics results in a growing interdependency between different fields of engineering. In
Language: en
Pages: 454
Pages: 454
Type: BOOK - Published: 2002 - Publisher: American Society of Mechanical Engineers
With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor i
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