3d Ic Stacking Technology
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Language: en
Pages: 543
Pages: 543
Type: BOOK - Published: 2011-10-14 - Publisher: McGraw Hill Professional
The latest advances in three-dimensional integrated circuit stacking technology With a focus on industrial applications, 3D IC Stacking Technology offers compre
Language: en
Pages: 544
Pages: 544
Type: BOOK - Published: 2011-07-07 - Publisher: McGraw Hill Professional
The latest advances in three-dimensional integrated circuit stacking technology With a focus on industrial applications, 3D IC Stacking Technology offers compre
Language: en
Pages: 251
Pages: 251
Type: BOOK - Published: 2010-12-07 - Publisher: Springer Science & Business Media
Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as
Language: en
Pages: 365
Pages: 365
Type: BOOK - Published: 2009-06-29 - Publisher: Springer Science & Business Media
This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-pa
Language: en
Pages: 655
Pages: 655
Type: BOOK - Published: 2019-01-25 - Publisher: John Wiley & Sons
This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and mate
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