3d Microelectronic Packaging

Download 3d Microelectronic Packaging full books in PDF, epub, and Kindle. Read online free 3d Microelectronic Packaging ebook anywhere anytime directly on your device. Fast Download speed and no annoying ads. We cannot guarantee that every ebooks is available!

3D Microelectronic Packaging

3D Microelectronic Packaging
Author :
Publisher :
Total Pages : 0
Release :
ISBN-10 : 9811570914
ISBN-13 : 9789811570919
Rating : 4/5 (919 Downloads)

Book Synopsis 3D Microelectronic Packaging by : Yan Li

Download or read book 3D Microelectronic Packaging written by Yan Li and published by . This book was released on 2021 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development. .


3D Microelectronic Packaging Related Books

3D Microelectronic Packaging
Language: en
Pages: 0
Authors: Yan Li
Categories:
Type: BOOK - Published: 2021 - Publisher:

DOWNLOAD EBOOK

This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture,
3D Microelectronic Packaging
Language: en
Pages: 465
Authors: Yan Li
Categories: Technology & Engineering
Type: BOOK - Published: 2017-01-20 - Publisher: Springer

DOWNLOAD EBOOK

This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, an
3D Microelectronic Packaging
Language: en
Pages: 629
Authors: Yan Li
Categories: Technology & Engineering
Type: BOOK - Published: 2020-11-23 - Publisher: Springer Nature

DOWNLOAD EBOOK

This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture,
Modeling and Simulation for Microelectronic Packaging Assembly
Language: en
Pages: 586
Authors: Shen Liu
Categories: Technology & Engineering
Type: BOOK - Published: 2011-08-24 - Publisher: John Wiley & Sons

DOWNLOAD EBOOK

Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still ba
Materials for Advanced Packaging
Language: en
Pages: 974
Authors: Daniel Lu
Categories: Technology & Engineering
Type: BOOK - Published: 2016-11-18 - Publisher: Springer

DOWNLOAD EBOOK

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have