Accelerated Wafer Level Integrated Circuit Reliability Testing For Electromigration In Metal Interconnects With Enhanced Thermal Modeling Structure Design Control Of Stress And Experimental Measurements

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Accelerated Wafer-level Integrated Circuit Reliability Testing for Electromigration in Metal Interconnects with Enhanced Thermal Modeling, Structure Design, Control of Stress, and Experimental Measurements

Author	: Chih-Ching Shih
Publisher	:
Total Pages	: 464
Release	: 1994
ISBN-10	: OCLC:39280929
ISBN-13	:
Rating	: 4/5 ( Downloads)

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Book Synopsis Accelerated Wafer-level Integrated Circuit Reliability Testing for Electromigration in Metal Interconnects with Enhanced Thermal Modeling, Structure Design, Control of Stress, and Experimental Measurements by : Chih-Ching Shih

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