High Performance Design Automation For Multi Chip Modules And Packages

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High Performance Design Automation For Multi-chip Modules And Packages
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Pages: 266
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Type: BOOK - Published: 1996-06-12 - Publisher: World Scientific

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Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller
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Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller
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Surveys the electrical and layout perspectives of System-in-Package, the system integration technology that has emerged as a required technology to reduce the s
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Multichip Module (MCM) technology has been used in high-end systems, such as mainframe and supercomputers as well as military and space applications for some ti
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Advantages of MCMs over traditional packaging methods for electronic-based applications in computers, aviation, and the military. Introduction to Multichip Modu