Measurement Of Thermal Mechanical Wirebond Displacement In Electrically Active Power Semiconductors

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Measurement of Thermal-mechanical Wirebond Displacement in Electrically Active Power Semiconductors

Author	: Seth M. Avery
Publisher	:
Total Pages	: 198
Release	: 2009
ISBN-10	: WISC:89106360076
ISBN-13	:
Rating	: 4/5 ( Downloads)

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Book Synopsis Measurement of Thermal-mechanical Wirebond Displacement in Electrically Active Power Semiconductors by : Seth M. Avery

Download or read book Measurement of Thermal-mechanical Wirebond Displacement in Electrically Active Power Semiconductors written by Seth M. Avery and published by . This book was released on 2009 with total page 198 pages. Available in PDF, EPUB and Kindle. Book excerpt: