New Developments In Semiconductor Research

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New Developments in Semiconductor Research

New Developments in Semiconductor Research
Author :
Publisher : Nova Publishers
Total Pages : 250
Release :
ISBN-10 : 1594545758
ISBN-13 : 9781594545757
Rating : 4/5 (757 Downloads)

Book Synopsis New Developments in Semiconductor Research by : Thomas S. Miller

Download or read book New Developments in Semiconductor Research written by Thomas S. Miller and published by Nova Publishers. This book was released on 2005 with total page 250 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book includes within its scope studies of the structural, electrical, optical and acoustical properties of bulk, low-dimensional and amorphous semiconductors; computational semiconductor physics; interface properties, including the physics and chemistry of heterojunctions, metal-semiconductor and insulator-semiconductor junctions; all multi-layered structures involving semiconductor components; dopant incorporation; growth and preparation of materials, including both epitaxial (e.g. molecular beam and chemical vapour methods) and bulk techniques; and in situ monitoring of epitaxial growth processes. Also included are appropriate aspects of surface science such as the influence of growth kinetics and chemical processing on layer and device properties. The physics of semiconductor electronic and optoelectronic devices are examined, including theoretical modelling and experimental demonstration; all aspects of the technology of semiconductor device and circuit fabrication. structures incorporating Langmuir-Blodgett films; resists, lithography and metalisation where they are concerned with the definition of small geometry structure. The structural, electrical and optical characterisation of materials and device structures are also included. The scope encompasses materials and device reliability: reliability evaluation of technologies; failure analysis and advanced analysis techniques such as SEM, E-beam, optical emission microscopy, acoustic microscopy techniques; liquid crystal techniques; noise measurement, reliability prediction and simulation; reliability indicators; failure mechanisms, including charge migration, trapping, oxide breakdown, hot carrier effects, electro-migration, stress migration; package-related failure mechanisms; and effects of operational and environmental stresses on reliability.


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