Polymeric Materials for Electronics Packaging and Interconnection
| Author | : John H. Lupinski |
| Publisher | : |
| Total Pages | : 520 |
| Release | : 1989 |
| ISBN-10 | : UOM:39015021583649 |
| ISBN-13 | : |
| Rating | : 4/5 ( Downloads) |
Book Synopsis Polymeric Materials for Electronics Packaging and Interconnection by : John H. Lupinski
Download or read book Polymeric Materials for Electronics Packaging and Interconnection written by John H. Lupinski and published by . This book was released on 1989 with total page 520 pages. Available in PDF, EPUB and Kindle. Book excerpt: From a symposium of the ACS 196th meeting, Los Angeles, CA, Sept. 1988. Thirty-nine chapters cover a broad spectrum of topics in four general areas: physical chemistry of materials, properties and applications of encapsulants and gels, and printed circuit board substrates and materials. Also includes a review of the marketing trends which drive packaging technology. Annotation copyrighted by Book News, Inc., Portland, OR
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