Three Dimensional Wafer Level Interconnects For Integration In High Speed Broadband Packaging And Circuit Applications

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Three Dimensional Wafer Level Interconnects for Integration in High Speed, Broadband Packaging and Circuit Applications

Author	: Swagata Riki Banerjee
Publisher	:
Total Pages	: 382
Release	: 2005
ISBN-10	: MINN:31951P00861181O
ISBN-13	:
Rating	: 4/5 ( Downloads)

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Book Synopsis Three Dimensional Wafer Level Interconnects for Integration in High Speed, Broadband Packaging and Circuit Applications by : Swagata Riki Banerjee

Download or read book Three Dimensional Wafer Level Interconnects for Integration in High Speed, Broadband Packaging and Circuit Applications written by Swagata Riki Banerjee and published by . This book was released on 2005 with total page 382 pages. Available in PDF, EPUB and Kindle. Book excerpt:

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