Accelerated Wafer-level Integrated Circuit Reliability Testing for Electromigration in Metal Interconnects with Enhanced Thermal Modeling, Structure Design, Control of Stress, and Experimental Measurements
| Author | : Chih-Ching Shih |
| Publisher | : |
| Total Pages | : 464 |
| Release | : 1994 |
| ISBN-10 | : OCLC:39280929 |
| ISBN-13 | : |
| Rating | : 4/5 ( Downloads) |
Book Synopsis Accelerated Wafer-level Integrated Circuit Reliability Testing for Electromigration in Metal Interconnects with Enhanced Thermal Modeling, Structure Design, Control of Stress, and Experimental Measurements by : Chih-Ching Shih
Download or read book Accelerated Wafer-level Integrated Circuit Reliability Testing for Electromigration in Metal Interconnects with Enhanced Thermal Modeling, Structure Design, Control of Stress, and Experimental Measurements written by Chih-Ching Shih and published by . This book was released on 1994 with total page 464 pages. Available in PDF, EPUB and Kindle. Book excerpt:
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