Characterization of Integrated Circuit Packaging Materials
| Author | : Thomas Moore |
| Publisher | : Elsevier |
| Total Pages | : 293 |
| Release | : 2013-10-22 |
| ISBN-10 | : 9781483292342 |
| ISBN-13 | : 1483292347 |
| Rating | : 4/5 (347 Downloads) |
Book Synopsis Characterization of Integrated Circuit Packaging Materials by : Thomas Moore
Download or read book Characterization of Integrated Circuit Packaging Materials written by Thomas Moore and published by Elsevier. This book was released on 2013-10-22 with total page 293 pages. Available in PDF, EPUB and Kindle. Book excerpt: Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues are discussed which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board and multi-chip models.
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