Materials Technology And Reliability Of Low K Dielectrics And Copper Interconnects

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Materials, Technology and Reliability of Low-k Dielectrics and Copper Interconnects

Author	: Ting Y. Tsui
Publisher	:
Total Pages	: 498
Release	: 2006
ISBN-10	: UOM:39015064810438
ISBN-13	:
Rating	: 4/5 ( Downloads)

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Book Synopsis Materials, Technology and Reliability of Low-k Dielectrics and Copper Interconnects by : Ting Y. Tsui

Download or read book Materials, Technology and Reliability of Low-k Dielectrics and Copper Interconnects written by Ting Y. Tsui and published by . This book was released on 2006 with total page 498 pages. Available in PDF, EPUB and Kindle. Book excerpt:

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