Thermal Copper Pillar Bump

Download or read book Thermal Copper Pillar Bump written by Fouad Sabry and published by One Billion Knowledgeable. This book was released on 2022-08-31 with total page 523 pages. Available in PDF, EPUB and Kindle. Book excerpt: What Is Thermal Copper Pillar Bump The thermal copper pillar bump is a thermoelectric device that is made from thin-film thermoelectric material and is embedded in flip chip interconnects. It is used in the packaging of electronic and optoelectronic components, such as integrated circuits (chips), laser diodes, and semiconductor optical amplifiers. The thermal bump is also known as the thermal copper pillar bump (SOA). Thermal bumps, as opposed to traditional solder bumps, which provide an electrical path and a mechanical connection to the package, act as solid-state heat pumps and add thermal management functionality locally on the surface of a chip or to another electrical component. Conventional solder bumps also provide a mechanical connection to the package. A thermal bump has a diameter of 238 micrometers and a height of 60 micrometers. How You Will Benefit (I) Insights, and validations about the following topics: Chapter 1: Thermal copper pillar bump Chapter 2: Solder Chapter 3: Printed circuit board Chapter 4: Ball grid array Chapter 5: Thermoelectric cooling Chapter 6: Flip chip Chapter 7: Thermoelectric materials Chapter 8: Desoldering Chapter 9: Thermal management (electronics) Chapter 10: Power electronic substrate Chapter 11: Flat no-leads package Chapter 12: Thermoelectric generator Chapter 13: Thermal management of high-power LEDs Chapter 14: Microvia Chapter 15: Thick-film technology Chapter 16: Soldering Chapter 17: Failure of electronic components Chapter 18: Glass frit bonding Chapter 19: Decapping Chapter 20: Thermal inductance Chapter 21: Glossary of microelectronics manufacturing terms (II) Answering the public top questions about thermal copper pillar bump. (III) Real world examples for the usage of thermal copper pillar bump in many fields. (IV) 17 appendices to explain, briefly, 266 emerging technologies in each industry to have 360-degree full understanding of thermal copper pillar bump' technologies. Who This Book Is For Professionals, undergraduate and graduate students, enthusiasts, hobbyists, and those who want to go beyond basic knowledge or information for any kind of thermal copper pillar bump.