Thermal Management of Die Stacking Architecture that Includes Memory and Logic Processor
| Author | : Bhavani Prasad Dewan Sandur |
| Publisher | : ProQuest |
| Total Pages | : |
| Release | : 2006 |
| ISBN-10 | : 0542810670 |
| ISBN-13 | : 9780542810671 |
| Rating | : 4/5 (671 Downloads) |
Download or read book Thermal Management of Die Stacking Architecture that Includes Memory and Logic Processor written by Bhavani Prasad Dewan Sandur and published by ProQuest. This book was released on 2006 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: This thesis focuses on carrying out a parametric study of stacking memory and the logic processor on the same substrate. In present technologies, logic processor and memory packages are located side-by-side on the board or they are packaged separately and then stacked on top of each other (Package-on-package [PoP]). Mixing memory and logic processor in the same stack has advantage and challenges, but requires the integration ability of economies-of-scale. The technology needed for packaging memory and logic dice on the same substrate is completely different as compared to packaging only memory dice or logic dice, or, packaging memory and logic separately and creating a single functional package [PoP]. Geometries needed were generated by using Pro/EngineerRTM Wildfire(TM) 2.0 as a Computer-Aided-Design (CAD) tool and were transferred to ANSYSRTM Workbench(TM) 10.0, where meshed analysis was conducted. Package architectures evaluated were rotated stack, staggered stack utilizing redistributed pads, and stacking with spacers, while all other parameters were held constant. The values of these parameters were determined to give a junction temperature of 100°C, which is an unacceptable value due to wafer level electromigration. A discussion is presented as to what parameters need to be adjusted in order to meet the required thermal design specification. In that light, a list of solutions consisting of increasing the heat transfer co-efficient on top of the package, the use of underfill, improved thermal conductivity of the PCB, and the use of a copper heat spreader were evaluated. Results are evaluated in the light of market segment requirements. (Abstract shortened by UMI.).
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