Tsv 3d Rf Integration

Download Tsv 3d Rf Integration full books in PDF, epub, and Kindle. Read online free Tsv 3d Rf Integration ebook anywhere anytime directly on your device. Fast Download speed and no annoying ads. We cannot guarantee that every ebooks is available!

TSV 3D RF Integration

TSV 3D RF Integration
Author :
Publisher : Elsevier
Total Pages : 294
Release :
ISBN-10 : 9780323996037
ISBN-13 : 0323996035
Rating : 4/5 (035 Downloads)

Book Synopsis TSV 3D RF Integration by : Shenglin Ma

Download or read book TSV 3D RF Integration written by Shenglin Ma and published by Elsevier. This book was released on 2022-04-27 with total page 294 pages. Available in PDF, EPUB and Kindle. Book excerpt: TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and high integration level. The book includes a detailed demonstration of the design and process development of Hr-Si interposer technology, gives case studies, and presents a systematic literature review. Users will find this to be a resource with detailed demonstrations of the design and process development of HR-Si interposer technologies, including quality monitoring and methods to extract S parameters. A series of cases are presented, including an example of an integrated inductor, a microstrip inter-digital filter, and a stacked patch antenna. Each chapter includes a systematic and comparative review of the research literature, offering researchers and engineers in microelectronics a uniquely useful handbook to help solve problems in 3D heterogenous RF integration oriented Hr-Si interposer technology. - Provides a detailed demonstration of the design and process development of HR-Si (High-Resistivity Silicon) interposer technology - Presents a series of implementation case studies that detail modeling and simulation, integration, qualification and testing methods - Offers a systematic and comparative literature review of HR-Si interposer technology by topic - Offers solutions to problems with TSV (through silicon via) interposer technology, including high frequency loss and cooling problems - Gives a systematic and accessible accounting on this leading technology


TSV 3D RF Integration Related Books

TSV 3D RF Integration
Language: en
Pages: 294
Authors: Shenglin Ma
Categories: Technology & Engineering
Type: BOOK - Published: 2022-04-27 - Publisher: Elsevier

DOWNLOAD EBOOK

TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-
Arbitrary Modeling of TSVs for 3D Integrated Circuits
Language: en
Pages: 181
Authors: Khaled Salah
Categories: Technology & Engineering
Type: BOOK - Published: 2014-08-21 - Publisher: Springer

DOWNLOAD EBOOK

This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model acco
Design of 3D Integrated Circuits and Systems
Language: en
Pages: 328
Authors: Rohit Sharma
Categories: Technology & Engineering
Type: BOOK - Published: 2018-09-03 - Publisher: CRC Press

DOWNLOAD EBOOK

Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration req
Physical Design for 3D Integrated Circuits
Language: en
Pages: 416
Authors: Aida Todri-Sanial
Categories: Technology & Engineering
Type: BOOK - Published: 2017-12-19 - Publisher: CRC Press

DOWNLOAD EBOOK

Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3
Three Dimensional System Integration
Language: en
Pages: 251
Authors: Antonis Papanikolaou
Categories: Architecture
Type: BOOK - Published: 2010-12-07 - Publisher: Springer Science & Business Media

DOWNLOAD EBOOK

Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as